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Easy to mill
in all
conditions.

The Profiltech
milling process.
1/1
The Profiltech milling process

All copper materials can be milled in all conditions. Our milling process does not introduce stresses into the material. The microstructure of the base material is thus not impacted.

Milling in no way affects the homogeneity of tensile strength, hardness, electrical or thermal conductivity over the profile width. Unlike other processes, milling does not change the microstructure of the base material.

The great design freedom of the cross-section allows a flexible design of the thickness transitions (flank angle, radii). Furthermore, the milling process allows close thickness tolerances to be achieved in longitudinal and transverse direction.

  • Less strip consumption per punched part
  • Low tool costs, as folding and embossing are not required during the punching process
  • Smaller tools and presses; shorter set-up and maintenance times
  • Higher productivity during punching, as higher punching speeds are possible
  • No readjustment of the punching parameters at coil changes
milled
rolled
Technological properties

During milling, stresses may be released depending on the condition – flatness, roll curvature, sabre, cutting edge quality – of the material supplied and the milling geometry. These stresses can affect the twist, transverse camber and sabre. In many cases, a straightening operation carried out before or during milling leads to an improvement in these parameters.

A member of the KEMPER Group